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Saturday, October 17, 2020 | History

2 edition of Development of adhesive bonds with reduced strength as ultrasonic NDE benchmarks. found in the catalog.

Development of adhesive bonds with reduced strength as ultrasonic NDE benchmarks.

Maciej Urban Jastrzebski

Development of adhesive bonds with reduced strength as ultrasonic NDE benchmarks.

by Maciej Urban Jastrzebski

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  • 14 Currently reading

Published .
Written in English


About the Edition

A method for producing adhesive-bonded aluminum joints with predictable strength loss was developed and evaluated. The method uses an open-face specimen geometry and a humid high-temperature environment to promote adhesive degradation. The rate of degradation was greatly increased over previous accelerated degradation schemes through the use of MgSO4 as contaminant. The contaminant was applied in a purpose-built aerosol contaminating duct. Specimens were prepared and fractured using a DCB loading jig. Two studies which examined the effects of various exposure and contamination parameters were conducted. It was shown that contaminant surface concentration is a strong determinant of residual adhesive strength. Exposure to the aggressive environment was shown to have little effect beyond an initial threshold. Standard ultrasonic imaging techniques were incapable of differentiating between exposed and unexposed specimens. FESEM and EDX analysis of the fracture surfaces showed residual aluminum, suggesting an intra-oxide locus of failure consistent with other accelerated degradation methods.

The Physical Object
Pagination157 leaves.
Number of Pages157
ID Numbers
Open LibraryOL19551751M
ISBN 109780494212790

The business field Adhesive Bonding Technology is principally concerned with the development and characteri-zation of adhesives, with the construc-tional design of adhesive bonds and with their realization and qualification. Another key area of work is the provi-sion of certified training courses and follow-up courses in the area of bond-ing. Characteristics of a weak bond (defective adhesive bond) are defined below: Strength as measured by mechanical testing is below 20% of the nominal bond strength, Mode of failure must be adhesive in type (i.e. purely at the adherend/adhesive interface), and Undetectable from normal bonds with conventional NDE techniques – includes kissing.

Intelligent Optical Systems, Inc. W. th Street Torrance, CA Phone: () [email protected] This paper discusses the use of pulse echo based ultrasonic testing for the inspection of adhesive bonds between very thick composite plates (thickness greater than 30 mm). Large wind turbine blades use very thick composite plates for its main structural members, and the inspection of adhesive bond .

Acknowledgments Fit and foremost, 1 thank my thesis supervisors, Dr. Jan Spelt and Dr. Anthony Sinclair, for their guidance and support throughout the course of this t a doubt, the past five years have been the greatest learning experience of my Life; Jan and Tony played significant des in that. Reduced weight, sealing capabilities, reduced part count and assembly time, as well as improved fatigue and corrosion resistance, all combine to provide the designer with customizable opportunities for assembly. Indeed, the fabrication of many modern vehicles, devices, and structures are dependent on the use of adhesives.


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Development of adhesive bonds with reduced strength as ultrasonic NDE benchmarks by Maciej Urban Jastrzebski Download PDF EPUB FB2

1. Introduction. The ultrasonic non-destructive evaluation (NDE) of adhesive bonds in aerospace applications is well established as a means of detecting cohesive defects such as voids; however, its use as a means of assessing loss of joint strength due to interfacial degradation without delamination remains to be by: 5.

The adhesive bond strength measured by a tensile testing is correlated with the interfacial stiffness. Experimental results show that the adhesive bond strength is linearly increasing with the increase in interfacial stiffness.

It demonstrates that the adhesive bond strength can be characterized using the single parameter of interfacial by: 8. the development of weak bond specimen sets to be provided to the NDT community adhesive bonds with reduced f racture strength as NDE benchmarks, Int.

J testing of structural adhesive. The capabilities of existing ultrasonic nondestructive evaluation (NDE) methods for the strength-related properties of bonds in structural components is reviewed.

The severe limitations of conventional NDE methods in yielding quantitative results are by: the development of weak bond specimen sets to be provided to the NDT community [1]. The poor adhesion defect is extremely difficult to detect using classical ultrasonic techniques because the bond strength is governed by a layer thinner than a conventional ultrasonic wavelength.

Surface treatments were chosen to modify the adhesion properties. FigType of defects in adhesive bond One of the problems when using adhesives is the occasional occurrence of “kissing bonds”, bonds in which surfaces are in intimate contact but with little bonding mostly governed by a poor surface preparation or a bad curing cycle of the adhesive.

These kissing bonds cannot be detected under. A model for the amplitude and phase of ultrasonic tone-bursts incident on adherend–adhesive interfaces is developed for both reflected and transmitted waves. The model parameters include the interfacial stiffness constants, which characterize the elastic properties of idealized adherend–adhesive interfaces having a continuum of bonds.

The ultrasonic continuum. Adhesive Bonds Sonic Testing I Adhesive Bond Testing Ultrasonic Testing.\ABSTRACT (Continue on reverse if necessary and identify by block number) his state-of-the-art report describes the bonding process, the destructive methods used to measure bond strength, and the various NDE methods that have been evaluated for deter-mining the quality of.

adhesive bond. This creates a high-resolution strength map (shown at right). The load frame versus displacement curve was compared with NDE inspection data. Simple adhesive strength laws based on bond width and thickness are adequate for predicting the wedge peel strength if the bond strength varies over multi-centimeter length scales.

Jastrzebski M, Sinclair A, Spelt J. Mechanical and industrial engineering, Development of adhesive bonds with reduced strength as ultrasonic NDE benchmarks. Toronto, Canada;   Ultrasonic wave techniques have proven to be an effective method for adhesive bonds of isotropic materials.

Ultrasonic-based methods can be classified as bulk waves (small wavelength relative to dimensions of the material) or guided waves (wavelength larger than. They demonstrated that a detailed sensitivity analysis is a necessary pre-requisite for the development of a robust inversion algorithm.

Accordingly, a new inversion scheme based on the method of least squares was developed by Iyer and Kinra to determine thickness from the measurements of phase, magnitude and complex spectrum, respectively, [ Adhesive bonding is an alternative to more traditional mechanical joining methods used in aerospace applications, such as riveting.

The assemblies created by the adhesive bonding method of joining materials are called adhesive joints or adhesive bonds. The adherends are the solid material (aluminum or composite) s being joined by the adhesive.

CiteScore: ℹ CiteScore: CiteScore measures the average citations received per peer-reviewed document published in this title. CiteScore values are based on citation counts in a range of four years (e.g.

) to peer-reviewed documents (articles, reviews, conference papers, data papers and book chapters) published in the same four calendar years, divided by the number of. An Ultrasonic Technique for Non-Destructive Evaluation of Metal-To-Metal Adhesive Bonds. Published: 0: Format: Pages: Price: PDF (K) 10 $ ADD TO CART: Complete Source PDF (M) $ ADD TO CART: Source: STPS.

Reprints and Permissions. Ultrasonic NDT had been used to investigate the adhesive bond quality with adherend integrity and interface quality evaluation, including disbond detection [4,5,6,7,8,9].In addition, investigations to detect weak and kissing bonds have been performed in various studies [10,11,12].Conventional longitudinal pulse-echo ultrasonic inspection as well as advanced measurement techniques, such as.

The ability to detect "weak" bonds and to predict service life are both very poor, and technology development is needed before more structural uses develop. Interesting new polymers have recently been developed, and understanding of surface science is improved.

The Quality Assurance of Adhesive Bonds by Ultrasonic Nondestructive Testing technology put forth in this book meets that need by describing two new, complementary ultrasonic techniques for the evaluation of these bonds, and thus provide improvements over previous methods. The development of a 20 MHz pulse-echo method for nondestructive Reviews: 1.

conventional NDT methods. Else these bonds would be considered as bond with defects (such as voids, porosity, disbonding, etc.). Next the EMI method was used. A promising results of us ing it for assessment of adhesive bonds was presented in [4].

A lap joint of aluminium with a piezoelectric sensor inside was studied. For the composite adhesive. structure because of their low weight, high strength and stiffness, as well as resistance to corrosion.

Adhesively bonded joints are one of the best options for joining composite materials. However, adhesive bonds are subject to damage such as adhesive defects, e.g.

disbonds, and cohesive defects, e.g. porosity. Ultrasonic guided wave. The Shear Bond Strength Test has represented for a long time the test of election to evaluate the adhesion strength of adhesive systems on enamel and dentin (1, 2).

This test is still used in dental research for its simple execution.The title of the present 9th edition volume was modified to reflect this new technology. Abstract studies conducted in the last two decades have demonstrated the effectiveness of guided ultrasonic waves (guws) for the nondestructive evaluation (nde), as well as for structural health monitoring (shm) of waveguides, such as pipes, plates, and rails.Page 1 of Journal Papers (updated 12 Dec.

) A. Adhesive Joining. B. Microelectronics Reliability. C. Abrasive Air-Jet Micro-machining. D. Abrasive Slurry-Jet Micro-machining.